DOI: 10.3290/j.jad.a8123Seiten: 271-275, Sprache: EnglischFranco, Eduardo B./Lopes, Lawrence G./D'Alpino, Paulo H. P./Pereira, José C./Mondelli, Rafael Francisco Lia/Navarro, Maria F. L.The objective of this in vitro study was to evaluate the bonding compatibility between different adhesives and a dual-cured resin cement, using a conventional tensile bond test.
The adhesives used were: Prime & Bond (PB) (Dentsply) (PB), Scotchbond Multi Purpose (SB) (3M), and the activator Self Cure (SC) (Dentsply). The dual-curing resin cement used was Enforce (EF) (Dentsply). Six groups with five specimens in each were tested: G1: EF/PB/EF (light cured); G2: EF/SB/EF (light cured); G3: EF/PB+SC/EF (light cured); G4: EF/PB+SC/EF (only chemically cured); G5: EF/EF (light cured); G6: EF/EF (only chemically cured). The resin cement was applied in two stainless steel molds with a cone-shaped perforation measuring 4 mm in diameter and 1 mm in thickness, and the adhesive was applied between them. Ten minutes after specimens were cured, the tensile strength was measured in a universal testing machine at a crosshead speed of 0.5 mm/min.
The mean values (MPa) ± SD obtained in each experimental group were: G1: 1.4 ± 0.2; G2: 1.3 ± 0.2; G3: 1.2 ± 0.4; G4: 0.8 ± 0.2; G5: 1.2 ± 0.1; G6: 0.7 ± 0.1. The results were statistically evaluated using nonparametric Kruskal-Wallis and Dunn tests (p = 0.05). Statistically significant differences among groups were found only between G1 and G4, and G1 and G6.
There was no incompatibility among the different adhesives used with dual-cured resin cement. The lowest tensile bond strength values occurred in the absence of photoactivation.